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| Datasheet File OCR Text: |
| Silicon Controlled Rectifier PROCESS CPS057 Sensitive Gate SCR Chip PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 3,374 PRINCIPAL DEVICE TYPES CS39-4D 2N2323 thru 2N2329 GLASS PASSIVATED MESA 57 x 57 MILS 8.7 MILS 0.6 MILS 24 x 14 MILS 7.9 x 7.9 MILS Al - 45,000A Al/Mo/Ni/Ag - 32,000A BACKSIDE ANODE 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R0 (7 -August 2003) |
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